High-Performance GEMPAK5060 Package Released
GEM Services has
released the GEMPAK5060 package, an advanced lead-less package with a
SO-8 footprint and an exposed die-pad to improve thermal and electrical
performance. Conceived in the era of small, single digit milli-ohm die,
the package was designed with inherent high current capability, and
uses proprietary low resistance connections from the pins to the die.
By using lead-less technology to increase footprint utilization, the
die size capability is also increased over a SO-8 package. The package
is 5.15 mm X 6.15 mm with a profile of only 1.05 mm.
is the first of a family of devices to use this proprietary lead-less
design. Other packages in development include smaller versions and
versions that will accommodate multiple die.