Services, Inc. Releases Lead-Free Plating Process
Shanghai, China, December 14, 2002-GEM Services,
Inc., a multinational semiconductor assembly and test contractor, has
released a totally lead-free plating process for its line of power
management packages. Eliminating lead from packages such as the TO-252
DPak allows its customers to comply with the latest environmental rules
with no in-house development costs.
The new process uses tin plating for the leads and
passes all solderability tests, allowing improved environmental
standards with no decrease in reliability or manufacturability of the
end product. GEM has qualified this process with several key accounts
and is shipping 100% of production lead-free for two key accounts.
The elimination of lead from all consumer and
industrial electronics is a high priority due to the short lifetime of
modern electronic items, such as personal computers. A high quantity of
computers are simply thrown out everyday, and are buried in landfills.
If this trend continues, and if these products contain lead, then
contamination of ground water could occur. By developing this lead-free
process, GEM has created a simple means for manufacturers to become
compliant with new regulations and to help protect the environment.
Founded in 1998, GEM provides total outsourcing of
semiconductor assembly and test. Specializing in small-outline packages
for power semiconductors, GEM Services provides both industry standard
and proprietary space-saving packages for the power management market.
GEM Services, Inc. is a privately held company
incorporated in the Cayman Islands with sales offices, logistics
centers and wholly-owned manufacturing subsidiaries in North America