GEM's New J-Lead Package!
GEM's 2021-8J package accommodates die up to 0.85mm
X 1.65mm, yet fits on a standard SC-70 (JEDEC MO-223A-BA) PC board
footprint. Eight leads give the option of both single or dual MOSFETs
in traditional "SO-8 style" layout, for easy connection and low
electrical and thermal impedance. The 8 leads may be configured in any
combination of electrical connections and thermal (direct die pad)
connections to maximize IC and PIC performance. Using the "modified
J-lead" (patents pending) technology, offers a performance/area ratio
that meets or exceeds any alternatives while utilizing construction
that has a long history of cost effective manufacturability, and
generations of reliability.