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GEM's Packaging Options
Click on the package name where a link is shown for technical specifications and construction details

Proprietary and Advanced Packages
GEMPAK
A high power package with the P.C. board footprint of a SO-8 package
GEMTAB
Low profile, low thermal impedance, clip-lead rectifier package with high surge current capability
GEM2021-8J
8 lead J-lead package with increased die size capacity in a SC-70 footprint
GEM2021-10J
10 lead J-lead package with increased die size capacity in a SC-70 footprint
GEM2928-8J
8 lead J-lead package with increased die size capacity in a TSOP-6 footprint
GEM2928-12J
12 lead J-lead package with increased die size capacity in a TSOP-6 footprint
GEM2928-14J
14 lead J-lead package with increased die size capacity in a TSOP-6 footprint
GEM4040-24J
release: Q4 '07
24 lead 4 mm x 4 mm space-saving cost-effective quad J-lead package
GEM4040-28J
release: Q4 '07
28 lead 4 mm x 4 mm space-saving cost-effective quad J-lead package
QFN-style packages
QFN-style capability for multi-chip packages and ICs


Industry-Standard IC Packages

• SO-8
• SO-14
• SSOP-20
• TSSOP-8


Industry-Standard Transistor Packages

• TO-3P
• TO-220
• TO-220CFM
• TO-220FM
• TO-252,  TO-251

 
 
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