GEM Services is a full service outsourcing provider
catering to both vertically integrated and fabless semiconductor
companies. From standard packaging to dedicated assembly lines and
co-development of new advanced packages, GEM allows you to focus on
your core competencies.
Services has a large staff of experienced packaging and test engineers
that will become part of your team. From determining the optimum
package and die layout to packaging innovation, GEM Services can work
with you to expand your portfolio and add value to your products
through packaging using our resources.
works with its customers to provide complete turn-key wafer processing.
Wafer probe for discretes and ICs and wafer bank storage are standard
has processes that use both epoxy and soft solder die attach, and gold
and aluminum wire, as well as direct electrical connection to the top
of the die. Packages in production at GEM include: SO- packages, TSSOP-
packages, industry standard power transistor packages and several
proprietary value-added packages. Click
here for a list of packages in production at GEM
Device Electrical Testing: GEM
Services offers a selection of testers, all optimized for high current
and/or high voltage as required for power management discrete devices
• Tesec 881-TT/A, 100 A max, 1200 V max
• FETEST 3602E, 120 A max, 1200 V max
• Semtest TT-1000, 20 A max, 3000 V max
In addition, for most packages, we have the option
of using analog IC testers for discrete devices as shown below.
and Power IC Electrical Testing: GEM
Services is experienced in testing analog ICs as well as complex power
ICs. By using the industry standard (Credence ASL1000 tester 100A max
850V max), test program development time is minimized.
Services performs all logistics services to facilitate receiving raw
materials into China and shipping finished goods out. We can also
maintain wafer bank and finished goods stock and drop ship to customers
directly. WIP reports and automated data transfers are available, along
with a web-based interface to view lot by lot WIP status.
Services can perform all standard environmental tests to qualify a new
product. Capabilities including solderability, HAST, HTRB, HTGB, power
cycle, temperature cycle, 85/85 and autoclave (pressure-pot) testing.