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Clip-Technology GEMTAB Package Released

GEM Services has released a new package optimized for two terminal devices such as rectifiers. The GEMTAB package is an ultra-small low-profile package using clip technology to eliminate bondwires. It is ideal for applications where both size and performance are critical. This package complements the existing portfolio of packages GEM provides for manufacturers of discrete power transistors and rectifiers such as DPAK, TO-220 and fully molded TO-220.

The GEMTAB package has high surge current capabilities due to its solder mount structure, and high power dissipation as a result of its clip-lead technology. These technologies have been added to GEM's portfolio for use in multi-chip and co-developed packaging solutions as part of this release.


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