GEMTAB Package Released
GEM Services has
released a new package optimized for two terminal devices such as
rectifiers. The GEMTAB package is an ultra-small low-profile
package using clip technology to eliminate bondwires. It is ideal for
applications where both size and performance are critical. This package
complements the existing portfolio of packages GEM provides for
manufacturers of discrete power transistors and rectifiers such as
DPAK, TO-220 and fully molded TO-220.
package has high surge current capabilities due to its solder
mount structure, and high power dissipation as a
result of its clip-lead technology. These technologies have been added
to GEM's portfolio for use in multi-chip and co-developed packaging
solutions as part of this release.