GEMís History

YearMilestones
1998GEM Services, Inc. , as the holding company, was incorporated in April.
GEM Electronics (Shanghai) Co., Ltd. was established in December.
As a manufacturing facility, we provide packaging and testing services for Power MOSFET, Diode and Power Management Ics.
2000Provide packaging and testing services for TO252(DPAK).
Provide packaging and testing services for SO8, GEM2021(2.0mmx2.1mm), GEM2928(2.9mm x2.8mm) and TSOP 3/5/6.
2002 Established strategic alliance with All Nippon Airways Trading Co., Ltd. for Japan market.
2003 Adopt Lead-free plating process, for Lead-free products providing.
2006 GEM Electronics (Hefei) Co., Ltd. was established in September.
Adopt copper wire bonding process to replace gold wire bonding process in SO8 manufacturing process, to saving the precious metals cost of materials.
2007 Provide packaging and testing services for GEMPAK5060(5.0mmx6.0mm) PDFN.
2008 GEM Electronics (Hefei) Co., Ltd. provides packaging and testing services for SO8,GEM2928,DPAK.
2010 Provide packaging and testing services for GEMPAK3333(3.3mmx3.3mm) DPFN.
2011 8In August, established a joint-venture company, Mitsubishi Electric GEM Power Device (Hefei) Company Limited, with Mitsubishi Electric Corporation (TOKYO: 6503)
2012 In June, Elite advanced laser corporation (TWSE: 3450) participate in cash replenishment, become the largest shareholder.
GEM Tech Limited was established in June.
GEM Tech, Ltd. Taiwan Branch was established in September.
Adopt aluminum ribbon bonding process in GEMPAK5060, provide low resistance and high efficiency of products.
2013 Provide packaging and testing services for TO251AA of 9mm long lead length products.
2014 Provide packaging and testing services for TO277.
GEM Electronics (Hefei) Co., Ltd. provides packaging and testing services for TO220FP High-Voltage products.
2015 Provide packaging and testing services for DIP23 products.
2016 Listed on the Taiwan Stock Exchange on April 12, and the Ticker Symbol is 6525.

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